

ABOUT ICoSeMT
4th International Conference on Semiconductor Materials and Technology (4th ICoSeMT 2025) is a biennial event that is jointly organized by Institute of Nano Optoelectronics Research and Technology (INOR), Universiti Sains Malaysia (USM), Universiti Teknologi MARA Cawangan Pulau Pinang (UiTMCPP), National Nanotechnology Centre (NNC), Ministry of Science, Technology and Innovation of Malaysia (MOSTI), MIMOS Berhad and Collaborative Research in Engineering, Science & Technology (CREST) with the Theme “Innovation Towards A Sustainable Tomorrow”. The primary focus of the conference is to create an effective medium for institutions and industries to share ideas, knowledge, and expertise in the fields related to Semiconductor Materials and Technology.
This year, with the aim to promote positive innovation culture and encourage innovation activities and from different walks of life, a sub-event entitled International Invention, Innovation & Design Expo (INoDEx 2025) is going to be held concurrently. This sub-event will be a great platform in creating opportunities for local and international participants to present their innovations and inventions. Eventually, both events will lead to interaction and future collaboration among the local and international participants.
TOPICS COVERED
- Narrow and Wide Band Gap Semiconductors
- Diamond, Graphene and Carbon Nanotubes
- Piezoelectric and Ferroelectric Materials
- Electroluminescent Materials
- Colour-Changing Materials
- Energy Storage Materials
- Dielectric Materials
- Porous Structures
- Nanostructures
- Superconductors
- Optoelectronics
- Sensors and Actuators
- Power Devices
- Novel Devices
- Photovoltaics
- MEMS/NEMS
- Contacts and Interconnects
- Fabrication Processes
- Integrated System Design
- Modelling and Simulation
- IC Design
- Organic Semiconductors
- Conductive Polymers
- Polymer Electronics and Coatings
- Polymer Catalysts and Characterization
- Composite Polymers and Biopolymers
- Functional Polymers and Polymer Hybrid Materials
- Phosphor Technology
- Lens and Optics
- Thermal Management
- Front End Assembly Processes
- Back End Processes and Applications
- Failure Analysis and Reliability
Hurry up! Grab this opportunity to submit your abstract.
Call for Paper
All full papers will be considered for publication in AIP Conference Proceedings
(Scopus-Indexed Proceeding)
Conference Fee

Payment Method
Payment Methods *
Cheque, L.O. / P.O., Electronic Fund Transfer, Cash Deposit
Instruction
You can pay your registration/publication fee using any of the following methods.
i) Cheque (Company Cheque only) / Bank Draft / Money Order / L.O. / P.O. must be made payable to “USAINS HOLDING SDN. BHD.”
ii) Automated Teller Machine (ATM) & Cash Deposit, Over-the-counter (OTC)
iii) Online Banking (Electronic Fund Transfer - EFT, Telegraphic Transfer - TT)
Please upload the payment proof (PO, Bank-in Slip, etc.) through your ICoSeMT user account. Please use your name as the file name.
Payee Details
a) Payee Name & Address:
USAINS HOLDING SDN. BHD., Level 2, Block C, SAINS@usm, No. 10 Persiaran Bukit Jambul, 11900 Bayan Lepas, Penang.
b) Bank Transfer Details:
Account Name: USAINS HOLDING SDN. BHD.
Name of Bank: AmBank (M) Berhad, Level 21, Menara Dion, Jalan Sultan Ismail, 50250 Kuala Lumpur.
Account Number: 888 – 100 – 985 - 0380
Swift Code: ARBKMYKL
c) Details:
3rd International Conference on Semiconductor Materials and Technology (ICoSeMT 2023) and 2nd International Innovation, Invention & Design Expo (INoDEx 2023)
Remark
Payment should be 'NO' later than July 18th, 2023. No refund policy will be adopted in this event.
Booth Exhibition Packages


SPONSORSHIP PACKAGES


For more information, kindly contact us at the following information:
Assoc. Prof. Dr. Ng Sha Shiong (shashiong@usm.my | +6013-4729700)
Dr. Siti Juliana Abu Bakar (sitijuliana@uitm.edu.my | +6019-4752209)
Sponsorship (Package S1):
Kindly contact us for the procedure and banking following
Sponsorship (Packages S2-S4):
Bank Information:
Account Name : Universiti Sains Malaysia
Bank : CIMB Bank Berhad
Account Number : 98986101402447
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